- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/52 - Arrangements for conducting electric current within the device in operation from one component to another
Patent holdings for IPC class H01L 23/52
Total number of patents in this class: 5536
10-year publication summary
403
|
334
|
341
|
296
|
277
|
264
|
152
|
96
|
43
|
15
|
2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Taiwan Semiconductor Manufacturing Company, Ltd. | 36809 |
564 |
Samsung Electronics Co., Ltd. | 131630 |
318 |
Micron Technology, Inc. | 24960 |
183 |
Renesas Electronics Corporation | 6305 |
180 |
Intel Corporation | 45621 |
138 |
STATS ChipPAC Pte. Lte. | 1516 |
135 |
Infineon Technologies AG | 8189 |
133 |
Panasonic Corporation | 20786 |
115 |
International Business Machines Corporation | 60644 |
113 |
GLOBALFOUNDRIES U.S. Inc. | 6459 |
113 |
Texas Instruments Incorporated | 19376 |
102 |
Kioxia Corporation | 9847 |
79 |
SK Hynix Inc. | 11030 |
70 |
Advanced Semiconductor Engineering, Inc. | 1546 |
64 |
Rohm Co., Ltd. | 5843 |
61 |
Qualcomm Incorporated | 76576 |
60 |
Tokyo Electron Limited | 11599 |
58 |
Amkor Technology Singapore Holding Pte.ltd. | 555 |
52 |
Shinko Electric Industries Co., Ltd. | 1186 |
45 |
Invensas Corporation | 645 |
45 |
Other owners | 2908 |